In the process of production and processing of SMT patches, there are often cases in which the selection of the patch glue is not appropriate, which results in the displacement of the film paste in the printed board processing, and the performance of the finished printed board is difficult to meet the actual conditions of electronic products. If necessary, it is more likely that the printing will be scrapped due to multiple failed repairs. This requires effective control of the selection process of the patch adhesive to prevent the occurrence of errors in the selection of the patch adhesive.
The specific use of glue must be selected according to the final use environment of the product. Therefore, it is not an exaggeration to say that in the selection process of the patch adhesive, the consideration of the constituent raw materials is one of the core areas to be paid attention to in the process of SMT patch welding.
After the basic raw material composition of the patch, the adhesive is determined, it is necessary to investigate and study the specific use performance of the patch adhesive according to the actual situation of the SMT welding process to ensure that the final selected patch adhesive can meet the actual work needs.
In the process of selecting the appearance of the patch adhesive for the soldering process, in order to ensure that the basic performance of the patch adhesive used in the manual soldering process meets the needs of the subsequent processing process, the following basic principles need to be met during the selection process:
The selected patch adhesive has a clear source to prevent the use of counterfeit patch adhesives, which will affect the performance of electronic products; The selected patch adhesive is free of foreign matter in appearance to prevent foreign materials in the patch adhesive from falling into the electronic product during the subsequent welding process, affecting the use performance of the electronic product.
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