The rigid PCB and flexible PCB are pressed together to form a multilayer board. In the pressing process, the flexible PCB is not glued together with the rigid PCB. The rigid cover covering the flexible PCB is cut and separated by laser fixed depth cutting, leaving the flexible part to form the soft and hard bonding board.
Such deep machining is also suitable for blind groove machining of surface embedded integrated elements in multilayer plates. The UV laser will precisely cut the blind slot of the target layer separated from the multi-layer circuit board. In this area, the target layer cannot be connected to the material covered above it.
SMT after the board cutting a variety of electronic components have been assembled circuit board, the process has been at the end of the production chain. For splitter boards, different techniques are available: for commonly used PCB’s, traditional cutting, stamping, and contour milling processes are preferred. For more complex electronic circuits and thin substrates especially sensitive to mechanical stress, dust and dimensional deviation, the use of UV laser cutting board is more advantageous. The following three charts evaluate these three approaches in terms of different factors.
For the cutting of the complete contour, LPKF of Germany suggests that the thickness of the cutting material should not exceed 1.6mm according to the different laser sources used. For some thicker materials, as well as expensive assembly components, safety and quality are prioritized, while cutting time is secondary.
By cutting the breakpoint board, the laser system cuts off the connection points through a machining process described above. The cutting process can be done close to the edge of the component and is economical for thicker boards.
UV laser is suitable for most materials because of its short wavelength.
For example, in the electronics industry it could be used for:
Not limited to the processing of the circuit board, the UV laser system can also complete the cutting, direct writing and drilling of LTCC components simultaneously in one processing operation.
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