How to avoid the Parts Falling on the First Side During the Second Reflow Soldering of SMT (Part 2)

Another type of dispensing operation will be on the side of the part. This can only be done after the solder paste is printed and the part is placed in a fixed position. If you are not careful, there is a risk of touching the part, so it is generally used for PIH parts . If you use a machine to dispense glue on the side, you must precisely control the amount of glue and the position of the glue, apply the glue to the edge of the part, and then use the nozzle of the placement machine to gently press the part to a fixed depth to ensure that the part is not raised. risk. Now because of the advancement of robot technology, many early dispensing projects that are not easy to control can have solutions. Zhongyan Electronics has seen the use of simple robotic arms to mount on the SMT streamline for dispensing solutions, and the cost will not be It’s very expensive. For those who need to do the dispensing process, of course, this is only suitable for a small amount of dispensing.

2. Used furnace carrier/tray

The furnace carrier can be designed such that the ribs just support the position of the heavier parts, so that the heavier parts are not easy to fall during the second reflow soldering. However, the cost of the furnace carrier is not cheap, and the total number of carriers must be greater than the length of the reflow oven, that is to say, how many boards are walking in the reflow oven at the same time, and buffering should be added. And the spare parts, there are not 30 or 20 in total, and there may be more, which is not expensive.