The PCB is made of different components and a variety of complex process technologies, among which the structure of the pcb circuit board has a single-layer, double-layer, and multi-layer structure, and the production methods of different hierarchical structures are different. This article will introduce in detail the component names and corresponding uses of PCB boards, the production of single-layer, double-layer, and multi-layer structures of pcb circuit boards and the main functions of various types of work levels.
First, the printed circuit board is mainly composed of pads, vias, mounting holes, wires, components, connectors, filling, electrical boundaries, etc. The main functions of each component are as follows:
Pad: A metal hole used for soldering component pins.
Mounting Hole: Used to fix the printed circuit board.
Wire: The copper film of the electrical network used to connect the pins of the components.
Connectors: Components used to connect between circuit boards.
Filling: Copper coating for ground wire network, which can effectively reduce impedance.
Electrical boundary: Used to determine the size of the circuit board. All components on the circuit board cannot exceed the boundary.
Second, the common layer structure of printed circuit boards includes three types: single layer PCB, double layer PCB and multi layer PCB. A brief description of these three layer structures as follows:
(1) Single-Layer Board: A circuit board with copper on one side and no copper on the other side. Usually components are placed on the side without copper, and the side with copper is mainly used for wiring and soldering.
(2) Double-Layer Board: A circuit board with copper on both sides, usually called the top layer on one side and the bottom layer on the other side. Generally, the top layer is used as the component placement surface, and the bottom layer is used as the component welding surface.
(3) Multilayer Board: A circuit board that contains multiple working layers. In addition to the top and bottom layers, it also contains several intermediate layers. Usually, the intermediate layers can be used as wire layers, signal layers, power layers, and ground layers. The layers are insulated from each other, and the connection between the layers is usually achieved through vias.
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