The process principle of the printed circuit board PCB resin plughole grinding production is to first use the special plug hole ink to cure the plughole, and then polish and remove the part of the ink that is higher than the copper surface, and then perform the wet film production according to the normal process flow of the normal non-plug hole board. Resin plug holes are generally completed after one copper electroplating. The grinding production process is: grinding plate→plug hole→curing→grinding.
In order to ensure the grinding quality of the inner plug hole and avoid the abnormal grinding quality caused by improper grinding equipment and grinding conditions, it is necessary to deal with the hole depression, the damage to the corner of the hole, the expansion, and contraction of the plate, the grinding roughness, the grinding amount, Grinding cost, thin plate ability and grinding wheel match ability and other characteristics are required and strictly controlled to improve the overall process yield. The equipment commonly used in the printed circuit board PCB plughole grinding process includes an automatic pressure-regulating grinding machine.
The grinding wheels used for automatic pressure-regulating grinders include ceramic grinding wheels and non-woven grinding wheels; on the whole, ceramic grinding wheels have better cutting ability and will not leave dents on the surface of the orifice after grinding, but they are expensive and have a long service life. Shorter is its disadvantage. The non-woven grinding wheel also has the excellent cutting ability, but due to its structural factors, it is easier to leave the hole in the hole after grinding. If the cost is considered, the price is much lower than that of the ceramic grinding wheel; it can be based on the characteristics of individual plug holes. Need to choose the most suitable grinding wheel combination for the actual work situation.
In terms of the expansion and contraction control of the printed circuit board PCB board, after testing with four-axis grinding; the inner layer board is rotated 90° and then after four-axis grinding, the best grinding roughness and expansion and contraction control can be obtained; for the orifice, The damage can also be distributed to avoid concentration in a single direction.
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