To ensure the quality of HDI circuit boards, manufacturers need to carry out a variety of inspection methods during the production process, and each inspection method will reveal different HDI circuit board defects. Below introduce how XPCB implements testing to guarantee the HDI circuit board’s quality.
1. Solderability test of HDI circuit board
The solderability test of HDI circuit boards focuses on the testing of pads and plated through holes. Standards such as IPC-S-804 stipulate the solderability test methods of HDI circuit boards, which include edge dipping test, rotary dipping test, and wave crest. Dip test and solder bead test, etc.
2. HDI circuit board internal defect detection
The detection of internal defects of HDI circuit boards generally adopts microsection technology, and the specific detection methods are clearly stipulated in relevant standards such as IPC-TM-650. The main inspection items for microsection inspection are the thickness of copper and tin-lead alloy coatings, the alignment of the internal conductor layers of the PCB multilayer circuit board, the laminated voids and the copper cracks.