4350B/4003C from Rogers
25N/25FR of Arlon
Taconic’s TLG series
The processing process is similar to epoxy resin/glass woven cloth (FR4), but the sheet is relatively brittle and easy to break. When drilling and routing, the life of the drill tip and routing knife is reduced by 20%.
Step 1: Cutting: the protective film must be kept to prevent scratches and creasing
Step 2: Drilling:
Step 3: Hole treatment
Plasma treatment or sodium naphthalene activation treatment is good for hole metallization
Step 4: PTH Copper Sink
Step 5: Solder mask
Step 6: Routing
Lay the white paper on the circuit surface of the PTFE board, and clamp it up and down with the FR-4 base plate or phenolic base plate with a thickness of 1.0MM etched to remove copper: as shown in the figure:
It is important to manually remove the burrs after the routing process so as to prevent damage to the substrate and copper surface, and then use sulfur-free paper for separation purpose.
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