The first step is to get a PCB. First, record the model, parameters, and positions of all vital parts on the paper, especially the direction of the diode, the three-machine tube, and the direction of the IC gap. It is best to use a digital camera to take two photos of the location of the vital parts.
The second step is to remove all the components and remove the tin in the PAD hole. Clean the PCB with alcohol, then put it into the scanner. When the scanner scans, you need to raise the scanned pixels slightly to get a clearer image. Start POHTOSHOP, scan the silk screen surface in color, and save the file and print it out for later use.
The third step is to lightly polish the TOP LAYER and BOTTOM LAYER with water-used gauze paper until the copper film is shiny, put it in the scanner, start PHOTOSHOP, and scan the two layers separately in color. Note that the PCB must be placed horizontally and straight in the scanner, otherwise the scanned image cannot be used, and the file should be saved.
The fourth step is to adjust the contrast and brightness of the canvas to make the part with copper film and the part without copper film have a strong contrast, then turn the second image into black and white, and check whether the lines are clear. If not, repeat this step. If it is clear, save the picture as black and white BMP format files TOP.BMP and BOT.BMP. If you find any problems with the graphics, you can also use PHOTOSHOP to repair and correct them.
The fifth step is to convert the two BMP format files to PROTEL format files, and transfer two layers in PROTEL. For example, the positions of PAD and VIA that have passed through the two layers basically coincide, indicating that the previous steps are well done. If If there is a deviation, repeat the third step.
The sixth step is to convert the BMP of the TOP layer to TOP.PCB, pay attention to the conversion to the SILK layer, which is the yellow layer, and then you can trace the line on the TOP layer, and place the device according to the drawing in the second step. Delete the SILK layer after drawing.
The seventh step is to convert the BMP of the BOT layer to BOT.PCB, pay attention to the conversion to the SILK layer, which is the yellow layer, and then you can trace on the BOT layer. Delete the SILK layer after drawing.
The eighth step is to import TOP.PCB and BOT.PCB in PROTEL and combine them into one picture.
The ninth step, use a laser printer to print TOP LAYER and BOTTOM LAYER on transparent film (1:1 ratio), put the film on the PCB, and compare whether there are errors. If they are correct, they are finished.
Others: If it is a multilayer board, you need to carefully polish the inner layer, and repeat the third to ninth steps. Of course, the naming of the graphics is also different. It depends on the number of layers. Generally, the double-sided board is better than the multi-layer board. The board is much simpler, and the multi-layer board copy board is prone to misalignment. Therefore, the multi-layer board copy board must be especially careful and careful (where the internal vias and non-vias are prone to problems).
XPCB Limited is a manufacturer specializing in the production of high-precision double-sided, multilayer and impedance, blind buried vias, thick copper circuit boards, products covering HDI, thick copper, backplanes, rigid-flex combined, buried capacitance and buried resistance, Golden Finger and other types of circuit boards, which can meet the needs of customers for various products.
XPCB Limited is a premium PCB & PCBA manufacturer based in China.
We specialize in multilayer flexible circuits, rigid-flex PCB, HDI PCB, and Rogers PCB.
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