X-ray: Full name X-ray non-destructive testing equipment, which uses low-energy X-rays to scan and image the inside of the product to detect flaws such as cracks and foreign objects in the content. This is the principle of X-ray scanning in hospitals.
With the intelligentization and miniaturization of electronic products, the size of the chip has become smaller and smaller, but there are more and more pins. Especially some central BGA and IC components are widely used. Due to the special package, the internal welding of the chip can only be stopped with the help of equipment. Ordinary artificial intelligence vision system inspection can not fundamentally judge the quality of solder joints, and artificial visual inspection was once the least accurate and least repeatable option in the case of dense solder joints. The best choice is to go through X -ray abort batch inspection.
Urgent orders and fast prototyping require more equipment to detect. X-ray inspection technology is widely used in BGA soldering quality inspection after reflow soldering to analyze the qualitative and quantitative risks of solder joints, find quality abnormalities, and adjust them in time. According to the summary and analysis of theoretical operation cases, the accuracy of X-ray inspection on the internal BGA solder joints can exceed 15% of manual ICT inspection, and the efficiency is even more than 50%.
In terms of application scope, the device can not only identify welding defects (such as empty welding, virtual welding) inside the BGA, but also scan and analyze microelectronic systems and sealing components, cables, fixtures, and plastic interiors, etc.
Therefore, for a processing factory and customers who have an understanding of quality control, they should choose scientific technologies and means to improve production and quality. Instead of blindly treating end users through all kinds of false publicity or indifferent attitude.
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