- +86-755-23012705
- Building 3, Jinfeng Industrial Park, Fuyong Street, Baoan District, Shenzhen ,China
- [email protected]
Layers ： 26L
Thickness ： 6.6mm
Out Layer Copper Thickness : 2 OZ
Inner Layer Copper Thickness : 2 OZ
Min hole size ：0.8mm
Min Line Width/Space : 3mil
Surface finish ： Hard Gold
Application ： IC testing instrument
Features : High complexity multilayer
