- +86-755-23012705
- Building 3, Jinfeng Industrial Park, Fuyong Street, Baoan District, Shenzhen ,China
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High-Quality ENIG + OSP Surface Finish
📌 Application: Computer Memory Board
| Layers | 4L |
| Thickness | 1.2mm |
| Outer Layer Copper | H OZ |
| Inner Layer Copper | H OZ |
| Min Hole Size | 0.2mm |
| Min Line Width/Space | 4mil |
| Surface Finish | ENIG + OSP |
⭐ Features: ICE Immersion Gold | Other Solder Pad | OSP
Starting from
Contact for Pricing
💰 Volume discounts available
📦 Availability: In Stock
🚚 Lead Time: 5-7 Business Days
🌍 Shipping: Worldwide Delivery
