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+86-755-23012705
Building 3, Jinfeng Industrial Park, Fuyong Street, Baoan District, Shenzhen ,China
Layers 6L
Stack-up :2R+2F+2R
Thickness 1.0mm
Out Layer Copper Thickness:1 OZ
Inner Layer Copper Thickness:1 OZ
Min hole size 0.2mm
Min Line Width/Space: 3mil
Surface finish :ENIG
Application : GPS module
Features : High quality of impedance matching