2020-09-17

Ultrafine Line Etching Process For Next Generation Packaging Technology

Low-cost, high-density interconnect (HDI) organic substrates are the most important conditions for implementing the system-level encapsulation (SOP) technique. The crux of the matter is that ultra-precision […]
2020-08-22
half hole PCB

Application & Manufacturing of RIGID PCBs

Definition of printed circuit board Printed circuit boards (PCBS) appear in almost every electronic device. If there are electronic components in a device, they are all […]
2020-08-20
HDI stackup

HDI Technology and Application Introduction

 HDI Circuit Board Overview & Advantages   HDI circuit board refers to the microvia (Microvia) with the aperture below 6mil, the hole ring diameter (HolePad) below […]