The TCD process mainly includes the following technical content: 　　 A. Plug hole technology 　　Before the screen printing thermosetting ink, the inner through holes should be […]

2. Thermosetting ink layering technology (referred to as TCD technology) 　　 TCD technology is a new technology for making SBU layer in HDI board by using […]

Many friends have asked me about the related technology of PCB multilayer board manufacturing. Here I answer this question in great details.  The manufacturing process of […]

Customizing multi-layer circuit board PCB vias is an important link. The types of customized PCB vias are divided into three types: “blind via”, “buried via” and […]