In order to completely solve the problem of air bubbles in the pressing of multi-layer boards and improve the adhesion between layers, it is an inevitable […]

Copper coating is to use the idle space on the PCB as the reference plane, and then fill it with solid copper. These copper areas are […]

Electroplating of high aspect ratio through holes is a key in the multi-layer board manufacturing process. Since the ratio of board thickness to aperture is higher […]

EIR＝IL2/2KD During electroplating, according to the characteristics of the multilayer board, in order to make the current evenly distributed on the inner surface of the hole […]