TCD process mainly includes the following technical contents: A. Plug Hole Technology Before screen printing the thermoset ink, the through holes of the inner layer should […]

Semi-Additive Method for Making Precise Fine Wires: The main process flow of the semi-additive method is: electroless copper on the whole board (generally, the thickness of […]

The development of horizontal electroplating technology is not accidental, but an inevitable result of the need for special functions of high-density, high-precision, multi-functional, high-aspect-ratio multilayer printed […]

According to the characteristics of horizontal electroplating, it is an electroplating method in which the way of placing the printed circuit board is changed from vertical […]