Texas Instruments (TI) invented a PowerPAD method to mount IC die onto metal platters. This die pad will support the die during manufacturing and act as […]

With thermal simulation, design engineers can predict the thermal performance of initial and subsequent designs without building and testing prototypes. Design variables such as the number […]

As consumers continue to demand smaller, faster speeds, a formidable challenge has arisen in addressing heat dissipation from ever-increasing density printed circuit boards (PCBs). As stacked […]

PCB plate making methods are divided into direct plate making method, direct indirect plate making method, indirect plate making method. The materials used are photosensitive paste […]