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2022-03-26

Analysis of The Causes of Blistering On The Surface of Copper Immersion Plating on PCB Boards (2)

5. Micro-etching in copper pretreatment and pattern electroplating pre-treatment. Excessive micro-etching will cause the orifice to leak the substrate and cause foaming around the orifice. […]

2022-03-26

How to Deal With Bulk Materials Processed by SMT

In the processing workshop of SMT chip processing, a part of bulk materials will be generated due to various reasons such as throwing materials, or separation […]

2022-03-26

Analysis of The Causes of Blistering On The Surface of Copper Immersion Plating on PCB Boards (1)

Blistering on the board surface is one of the more common quality defects in the production process of circuit boards. Because of the complexity of the […]

2022-03-25

Analysis of PCB Vacuum Etching Technology (1)

An Improved Etching Technique for Ultra-Fine Structures By Frank Baron and Ron Salerno The etching process is one of the basic steps in the PCB production […]