3. Semi-additive method to produce precision fine wire technology    The main process flow of the semi-additive method is: electroless copper sinking on the whole board […]

Then press the pre-designed positioning system to carry out CNC drilling. After drilling, the hole wall should be etched and de-drilled, and then the process of […]

As electronic products demand more and more functions, the structure of pcb circuit boards is becoming more and more complex. Due to the space limitation of […]

The TCD process mainly includes the following technical content: 　　 A. Plug hole technology 　　Before the screen printing thermosetting ink, the inner through holes should be […]