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2021-10-15

Factors Affecting the Quality of BGA Patch Assembly (1/3)

Preface With the rapid development of very large scale integrated circuits (IC), traditional packaging types cannot meet the needs of electronic assembly, and due to the […]

2021-10-15

Factors Affecting the Quality of BGA Patch Assembly （2/3）

Through holes are allocated to BGA pads from the outside. This type of pad is most suitable for BGA components with a small number of I/Os. […]

2021-10-15

How to Determine Whether the FPC Flexible Board Is Good or Bad

FPC is the abbreviation of Flexible Printed Circuit, also known as flexible circuit board, flexible printed circuit board, flexible circuit board, or FPC for short; with […]

2021-10-15

10 Common Problems of FPC Flexible Board Surface Defects

With the gradual development of electronic products, they turn to become short, small, light and thin, the advantages of FPC flexible board is are very obvious, […]