1. The main manifestations of chip capacitor failure In the actual maintenance of SMD capacitors, the main failures of capacitors are as follows: Open circuit failure […]

4. Adopt the method of mixing high and low solder paste In fact, XPCB Limited does not recommend this method, because the solder strength of low-temperature […]

In addition, because the furnace carrier needs to withstand the high temperature of repeated reflow soldering many times, it is generally made of metal material or […]

Another type of dispensing operation will be on the side of the part. This can only be done after the solder paste is printed and the […]