The development of horizontal electroplating technology is not accidental, but an inevitable result of the need for special functions of high-density, high-precision, multi-functional, high-aspect-ratio multilayer printed […]

According to the characteristics of horizontal electroplating, it is an electroplating method in which the way of placing the printed circuit board is changed from vertical […]

Under the action of the electric field, the ions in the electroplating solution are subjected to electrostatic force to cause ion transport, which is called ion […]

With the rapid development of microelectronics technology, the manufacturing of printed circuit boards is developing in the direction of multi-layer, lamination, functionalization and integration, which makes […]