Electrochemical Copper-Free Process: The main purpose of the preprocessing step: 1. To ensure the continuous integrity of the electroless copper deposition layer. 2. Ensure the bonding […]

In the patch processing of electronic processing plants, the use of patch glue is a frequently used processing raw material. In actual production and processing, there […]

Detailed explanation of relevant design parameters: A. Vias (commonly known as conductive holes) 1. Minimum aperture: 0.3mm (12mil) 2. The minimum via hole (VIA) diameter should […]

Matters Needing Attention in PCB Manufacturing Process A. The original document about the PADS design 1. The hole attribute in the double-sided file PADS should select […]