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2021-08-31

DIP plug-in unit

DIP is a kind of in-line packaging technology, which uses dual in-line method to package the circuit board and finally form an integrated circuit. Most small-scale […]
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2021-08-30

Additional production documents required during the processing of SMT

Precautions It is a reminder from the product development company to the factory that the product needs special attention during the patching process. For example, manual […]
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2021-08-30

The basic production documents needed in the process of SMT processing.

Gerber file The Gerber file is a file exported from the PCB file. The content of this file covers the Pad layer (pad layer), the solder […]
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2021-08-30

SMT small batch patch production factory’s first piece test method for processing

The first piece test of SMT patch proofing is very important. As long as the component specification, model, and polarity direction of the first piece are […]
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