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2022-01-10

Description And Reasons of Poor Plating During Electroplating 2/3

Description And Reasons of Poor Plating During PCB Electroplating: 11. Recess plating. There are sparse and dense irregular cavities on the surface of the coating (different […]

2022-01-08

Process Technology for Improving the Quality of Multilayer Board Laminating (1)

Due to the rapid development of electronic technology, the continuous development of printed circuit technology has been promoted. PCB boards have developed through single-sided-double-sided and multi-layered […]

2022-01-08

Process Technology for Improving the Quality of Multilayer Board Laminating (3)

How to improve the quality of multi-layer board lamination? D. Organic matching of lamination parameters control of multi-layer board lamination parameters mainly refers to the organic […]

2022-01-08

Process Technology for Improving the Quality of Multilayer Board Laminating (2)

How to improve the quality of multi-layer board lamination? B. To meet the requirements of PCB users, select the appropriate PP and CU foil configuration. Customers’ […]