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2021-10-28

How to Improve The Heat Dissipation Problem of PCB

For electronic equipment, a certain amount of heat is generated during operation, so that the internal temperature of the equipment rises rapidly. If the heat is […]

2021-10-28

Introduction of Solder Paste Stencil Demolding During SMT Patch Processing

The quality of demolding directly affects the printing effect. Generally, automatic visual printers have two demolding methods: “first scraper and then demolding”, which are more commonly […]

2021-10-28

Introduction of Patch Adhesive in SMT Patch Processing (Part 2)

During the welding process In the selection process of the viscosity performance of the patch adhesive, it is necessary to fully realize that the viscosity is […]

2021-10-28

Introduction of Patch Adhesive in SMT Patch Processing (Part 1)

In the process of production and processing of SMT patches, there are often cases in which the selection of the patch glue is not appropriate, which […]