Electroplating of high aspect ratio through holes is a key in the multi-layer board manufacturing process. Since the ratio of board thickness to aperture is higher […]

EIR＝IL2/2KD During electroplating, according to the characteristics of the multilayer board, in order to make the current evenly distributed on the inner surface of the hole […]

Texas Instruments (TI) invented a PowerPAD method to mount IC die onto metal platters. This die pad will support the die during manufacturing and act as […]

With thermal simulation, design engineers can predict the thermal performance of initial and subsequent designs without building and testing prototypes. Design variables such as the number […]