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2022-03-30

Analysis on Electroplating Technology of High Aspect Ratio Multilayer Board (1)

Electroplating of high aspect ratio through holes is a key in the multi-layer board manufacturing process. Since the ratio of board thickness to aperture is higher […]

2022-03-30

Analysis on Electroplating Technology of High Aspect Ratio Multilayer Board (2)

EIR＝IL2/2KD During electroplating, according to the characteristics of the multilayer board, in order to make the current evenly distributed on the inner surface of the hole […]

2022-03-29

Latest PCB Cooling Technology (2)

Texas Instruments (TI) invented a PowerPAD method to mount IC die onto metal platters. This die pad will support the die during manufacturing and act as […]

2022-03-29

Latest PCB Cooling Technology (3)

With thermal simulation, design engineers can predict the thermal performance of initial and subsequent designs without building and testing prototypes. Design variables such as the number […]