1. Bridging The causes of bridging are mostly caused by excessive solder or severe edge collapse after solder printing, or the size of PCB substrate solder […]

Here are 10 things to pay attention to: 1. The outer frame (clamping edge) of the PCB assembled board should adopt a closed-loop design to ensure […]

One of the unique processes of the flexible printed board manufacturing process is the processing procedure of the cover layer. There are three types of processing […]

3. Electroplating Pits   There are many processes caused by this defect, from copper immersion, pattern transfer, to electroplating pretreatment, copper plating and tin plating. The […]