Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
2022-05-05
I. Introduction The purpose of Prinetd Circuit Board Etching Process: After the circuit is electroplated, the board removed from the electroplating equipment is processed to complete […]
2022-05-04
1. Classification of Electroplating Processes: Acid Bright Copper Electroplating Nickel/Gold Electroplating Tin Electroplating 2. Process Flow: Pickling → copper plating on the whole PCB board → […]
2022-05-04
(3) Acid Degreasing ① Purpose and Function: Remove the oxides on the copper surface of the circuit, the residual glue of the ink residue film, and […]
2022-05-04
(9) Nickel Plating ① Purpose and Function: The nickel-plated layer is mainly used as a barrier layer between the copper layer and the gold layer to […]
