Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
2022-03-30
Electroplating of high aspect ratio through holes is a key in the multi-layer board manufacturing process. Since the ratio of board thickness to aperture is higher […]
2022-03-30
EIR＝IL2/2KD During electroplating, according to the characteristics of the multilayer board, in order to make the current evenly distributed on the inner surface of the hole […]
2022-03-29
Texas Instruments (TI) invented a PowerPAD method to mount IC die onto metal platters. This die pad will support the die during manufacturing and act as […]
2022-03-29
With thermal simulation, design engineers can predict the thermal performance of initial and subsequent designs without building and testing prototypes. Design variables such as the number […]
