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2021-09-18
1. The main manifestations of chip capacitor failure In the actual maintenance of SMD capacitors, the main failures of capacitors are as follows: Open circuit failure […]
2021-09-16
4. Adopt the method of mixing high and low solder paste In fact, XPCB Limited does not recommend this method, because the solder strength of low-temperature […]
2021-09-16
In addition, because the furnace carrier needs to withstand the high temperature of repeated reflow soldering many times, it is generally made of metal material or […]
2021-09-16
Another type of dispensing operation will be on the side of the part. This can only be done after the solder paste is printed and the […]
