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2021-08-31
DIP is a kind of in-line packaging technology, which uses dual in-line method to package the circuit board and finally form an integrated circuit. Most small-scale […]
2021-08-30
Precautions It is a reminder from the product development company to the factory that the product needs special attention during the patching process. For example, manual […]
2021-08-30
Gerber file The Gerber file is a file exported from the PCB file. The content of this file covers the Pad layer (pad layer), the solder […]
2021-08-30
The first piece test of SMT patch proofing is very important. As long as the component specification, model, and polarity direction of the first piece are […]
