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2022-03-04
The development of horizontal electroplating technology is not accidental, but an inevitable result of the need for special functions of high-density, high-precision, multi-functional, high-aspect-ratio multilayer printed […]
2022-03-03
According to the characteristics of horizontal electroplating, it is an electroplating method in which the way of placing the printed circuit board is changed from vertical […]
2022-03-03
Under the action of the electric field, the ions in the electroplating solution are subjected to electrostatic force to cause ion transport, which is called ion […]
2022-03-03
With the rapid development of microelectronics technology, the manufacturing of printed circuit boards is developing in the direction of multi-layer, lamination, functionalization and integration, which makes […]
