Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
Warning: Trying to access array offset on false in
/www/wwwroot/www.x-pcb.com/wp-content/themes/yougu/functions/theme-functions.php on line
1611
2021-10-14
3、 Criteria for Inspection Standards 3.1 Printing Inspection General rule: The amount of solder paste printed on the pad is allowed to have a certain […]
2021-10-14
1. SMT Quality Terminology Ideal Solder Joint Good surface wettability. That is, the molten solder shall be spread on the surface of the metal to be […]
2021-10-14
Most smt chip components are reflow soldered, while through-hole components are wave soldered, though it is not a hard and fast rule. In through-hole pcb assembly […]
2021-10-13
In PCB design, it is required to select DC / DC or LDO for power chip design. 1、 Simply put, in the case of boost, only […]
